Thermal management in electronics

We have extensive experience in thermal management materials, and in helping our customers with heat dissipation in electronics. Heat conduction materials based on silicone have great advantages, among other things, the material has very low surface tension and can therefore provide maximum contact surface against the hot part. This wetting property is crucial for achieving high overall heat dissipation. We provide several types of technology for heat dissipation in electronics: moulding compounds for moulding, Gap Pads and Gap Fillers for filling air spaces, thermally conductive adhesives for cooling heat sinks, and grease as a heat transfer medium between heating element and heat sink.

With the rapid development of electrical products, the need for efficient heat management is increasing. Electronic components generate heat which, if not dissipated, can lead to performance degradation, shortened lifetime and, in the worst case, total product failure.

Managing this heat is not only a technical challenge, but also a key to creating reliable and competitive products.

Silicone has established itself as an optimal material for thermal conduction in electronics. It is a pure material that is not classed as a thermoset, making silicone products very friendly to work with in the manufacturing process and more gentle on the environment. Its unique combination of properties makes it ideal for filling voids and conducting away heat generated from components.

We offer silicone-based thermally conductive materials in several forms, adapted for different applications and manufacturing processes.

Silicone for thermal conduction in electronic products
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