Managing this heat is not only a technical challenge, but also a key to creating reliable and competitive products.
Silicone has established itself as an optimal material for thermal conduction in electronics. It is a pure material that is not classed as a thermoset, making silicone products very friendly to work with in the manufacturing process and more gentle on the environment. Its unique combination of properties makes it ideal for filling voids and conducting away heat generated from components.
We offer silicone-based thermally conductive materials in several forms, adapted for different applications and manufacturing processes:
Thermally conductive moulding compound
To protect sensitive electronics, moulding is a common method, but a major challenge arises when the electronics generate a lot of heat. If the heat is not dissipated efficiently, it can lead to overheating, which in turn damages the components and shortens their lifetime. The solution to this is to use a thermally conductive silicone moulding compound.
Gap Pads
Gap Pads for thermal management in electronics are soft and mouldable silicone-based materials used to fill spaces between a hot component, such as a processor or chip, and a heat sink. They act as a thermal bridge that conducts heat away from the component.
Gap Fillers
A Gap Filler is a mouldable material designed to fill imperfections and air that exists between two surfaces. For thermal management, it is specifically designed to be highly conductive, and is often manufactured as a mouldable paste.
Thermally conductive silicone adhesive
Thermally conductive silicone adhesive is a specialised adhesive that not only provides a strong mechanical bond but also an effective thermal conduction path between the component and its heat sink or chassis.
